The future of China's hardware connector market to the development of precision

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Affected by the global economic environment, the sales volume of the global connector market in the first half of 2012 decreased by 3-4 percentage points compared with the previous year. However, overall, due to the relatively mild economic recession than the previous two, the market has improved from the fourth quarter of 2012. The total sales volume of the global connector market in 2012 is about US $47.1 billion, and the market is expected to maintain a slight growth level of 4.2 percent in 2013, sales were about $49.1 billion. In terms of market supply, most connector suppliers reflect that the current price of connector products is still at a relatively stable level, but some distributors and original equipment manufacturers have become more conservative in their procurement efforts, reducing the number of orders and increasing the order frequency, making the usual 6-week delivery time shorter.
For the growth of the market in 2013, Luo Baihui is optimistic about the Internet of Things device market. Ultra-mobile (ultra-mobile) devices including smart phones, tablet computers, and personal navigators have become the main market for connector products. Especially in the low-cost smartphone segment priced at approximately US $150, Chinese mobile phone manufacturers will further significantly increase their shipments, and require more functionality to be placed in increasingly compact devices, while achieving Faster time to market. On the other hand, as the global demand for plug-in electric vehicles has maintained steady growth in recent years, people have paid more and more attention to the built-in connectivity of devices in such harsh environments, and various pure electric/hybrid electric vehicle (EV/HEV) connector solutions have emerged. In addition, the growth potential of the new energy market should not be underestimated. Although the current development of renewable energy based on solar and wind energy is still limited, in the next few years, with the increase of government policy incentives around the world, this The market will usher in a stage of vigorous development, and more connector manufacturers will begin to look for new business opportunities in this dynamic and challenging market.
From the perspective of application requirements, reducing the packaging volume of devices as much as possible has become the mainstream trend in the electronic manufacturing industry, especially the lightweight and multi-functional characteristics of portable networked electronic devices, forcing connector products to face severe research and development. The focus of market demand is on how to achieve effective connection and external interconnection in a limited space. In some specific applications, the traditional I/O input and output connector has become one of the focus of market competition. For example, the Lightning (lightning) connector announced by Apple, as well as the I/O interface connector with greater signal density and higher transmission bandwidth developed for some high-end data centers and server farms, have become the latest vane in product development in the current connector industry.
High reliability and durability are essential
The thin development of portable electronic devices makes more and more products need to complete the circuit design in the high compact internal structure, as well as the corresponding circuit and interface design. Under this trend, all kinds of connector products are moving in the direction of refinement. On the one hand, the number of connectors is increasing, but the center spacing is smaller; on the other hand, the height of the connector is also getting smaller and smaller, accounting for less and less space. In the development of such high-density connectors, in the face of more micro, thin devices, and more harsh application environment, how to ensure the mechanical durability of the connector products and stable contact resistance, is a key issue that manufacturers need to solve.
Weng Weixiong, regional marketing manager of Molex Company, said that taking wire-to-board interconnection as an example, one of the main challenges at present is that connector pins are extremely vulnerable to damage under high insertion force. Therefore, compact component-intensive equipment needs to maintain high reliability and high durability during connector mating. In view of this problem, the Micro-Lock single-row connector introduced by Molex can provide lower insertion force in the industry for 2.00mm pitch connectors, and has the protection function of preventing pin damage. Using its protective wall (Guardwall) and detent (Detent) characteristics, the rubber shell is guided into the connector, and the pin is touched only when the shell is aligned, thus realizing safe and damage-free mating and avoiding bending or damage of the pin of the connector during angled mating, it can be widely used in line-to-board connection applications for game consoles, LCD and PDP flat panel displays.
In mobile phone applications with removable backplanes, TE's latest ultra-thin plug-in MicroSIM card connector is only 1.24mm high, making it ideal for compact and stylish consumer electronics products. It has two mounting positions (6-bit or 8-bit), which can provide greater flexibility in the size design of the terminal equipment. In order to improve the connection reliability, this product is equipped with a unique SIM card detection switch contact, which can better protect the circuit connection without taking up additional PCB space. The enhanced MicroSIM misinsertion prevention function can prevent incorrect card insertion and avoid damage to the connector contact due to improper insertion of the SIM card. In addition, TE's newly developed ultra-thin battery connector is only 1.9mm thick, which can be applied to all kinds of mobile devices, while also taking into account the optimization of reliability and durability. Durability tests show that the connector can withstand 5,000 plug-in tests without causing any damage to the contacts.
In the harsh application environment of the automotive industry, the biggest problem for designers is undoubtedly the vehicle vibration that can easily damage the interconnection system. For such special places of use, Molex's DuraClik2.00mm(0.079 ") pitch wire-to-board connector system can provide safe mating and PCB retention without worrying about the stable reliability of the connector even in high vibration applications.
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